지속적 가입 주사식 열중합 의치상 레진에 대한 열중합 자가중합 및 광중합 레진의 결합력에 관한 비교분석
Comparative tensile bond strength of heat-cured cold-cured and light cured denture base resins bonded to continuous-pressure injection type denture base resin
황승우, 정문규,
소속 상세정보
황승우 ( Whang Seung-Woo ) - 연세대학교 치과대학 치과보철학교실
정문규 ( Chung Moon-Kyu ) - 연세대학교 치과대학 치과보철학교실
KMID : 0362419930310030385
Abstract
Injection processing of denture base resin was introduced by Pryor in 1942, in an attempt to reduce processing shrinkage. More recently a continuous-pressure injection type technique has been developed (SR-Ivocap, Ivoclar AG, Schaan,
Liechtenstein), and it reduced processing error and increased resin density. The purpose of this study was to compare tensile bond strength of heat-cured, cold-cured, and light-cured denture base resin bonded to continuous-pressure injection type resin. To know it, 60 cylindrical resin specimens were fabricated, and tensile bond strength were measured. @ES The results were as follows; @EN 1. The mean tensile bond strength bonded to continuous-pressure injection type resin was lower than bonded to conventional heat cured resin. But tensile bond strength of conventional heat cured resin bonding with light cured resin was lower than continuous-pressure injection type resin. 2. Of the tensile bond strength bonded to continuous-pressure injection type resin, tensile bond strength bonding with continuous-pressure injection type resin was the greatest(but not significantly different from bonding with conventional heat cured resin), followed by cold-cured, light-cured resin. 3. Of the tensile bond strength bonded to conventional heat cured resin, tensile bond strength bonding with conventional heat cured resin was the greatest and followed by continuous-pressure injection type resin, cold-cured resin, light-cured resin. According to these results, bonding of continuous-pressure injection type resin with conventional heat cured resin or continuous-pressure inection type resin is acceptable, but bonding with light cured resin is questionable.
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